1. SECOND CYCLE - MASTER'S DEGREE
  2. THE GRADUATE SCHOOL OF NATURAL AND APPLIED SCIENCES
  3. ELECTRICAL AND ELECTRONICS ENGINEERING DEPARTMENT
  4. 1181 Electrical and Electronics Engineering
Course Information Course Learning Outcomes Course's Contribution To Program ECTS Workload Course Details
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COURSE INFORMATION
Course CodeCourse TitleL+P HourSemesterECTS
ELK 594INTRODUCTION TO MICROELECTROMECHANICAL SYSTEMS3 + 01st Semester7,5

COURSE DESCRIPTION
Course Level Master's Degree
Course Type Elective
Course Objective Microelectromechanical Systems (MEMS) technology providing machining of Silicon (Si) in the micro-level puts forth promising solutions to develop small, portable, robust and low-cost sensor systems. Today, MEMS technology has different implementations used in various areas ranging from automotive, biomedical, telecommunication, consumer electronics to military applications. The aims of this course are to introduce Microelectromechanical Systems and to give general understanding about the design and fabrication methods of the microstructures as well as different types of MEMS sensors and their sensing mechanism.
Course Content Introduction of the properties of Silicon (Si) element, Silicon etching methods, photolithography, thin film deposition, bulk and surface micromachining, microstructure fabrication process and sensing mechanisms.
Prerequisites No the prerequisite of lesson.
Corequisite No the corequisite of lesson.
Mode of Delivery Face to Face

COURSE LEARNING OUTCOMES
1Students knows the basic concepts related with the MEMS technology.
2Students are familiar with the fabrication methods used in the MEMS technology.
3Students are familiar with the working principles and the different type of sensing mechanisms of MEMS sensor.

COURSE'S CONTRIBUTION TO PROGRAM
PO 01PO 02PO 03PO 04PO 05PO 06PO 07PO 08PO 09PO 10PO 11
LO 001           
LO 002           
LO 003           
Sub Total           
Contribution00000000000

ECTS ALLOCATED BASED ON STUDENT WORKLOAD BY THE COURSE DESCRIPTION
ActivitiesQuantityDuration (Hour)Total Work Load (Hour)
Course Duration (14 weeks/theoric+practical)14342
Hours for off-the-classroom study (Pre-study, practice)14570
Assignments11515
Mid-terms12323
Final examination13030
Presentation / Seminar Preparation11515
Total Work Load

ECTS Credit of the Course





195

7,5
COURSE DETAILS
 Select Year   


 Course TermNoInstructors
Details 2023-2024 Fall1SERDAR TEZ


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Course Details
Course Code Course Title L+P Hour Course Code Language Of Instruction Course Semester
ELK 594 INTRODUCTION TO MICROELECTROMECHANICAL SYSTEMS 3 + 0 1 Turkish 2023-2024 Fall
Course Coordinator  E-Mail  Phone Number  Course Location Attendance
Asts. Prof. Dr. SERDAR TEZ stez@pau.edu.tr MUH A0497 %
Goals Microelectromechanical Systems (MEMS) technology providing machining of Silicon (Si) in the micro-level puts forth promising solutions to develop small, portable, robust and low-cost sensor systems. Today, MEMS technology has different implementations used in various areas ranging from automotive, biomedical, telecommunication, consumer electronics to military applications. The aims of this course are to introduce Microelectromechanical Systems and to give general understanding about the design and fabrication methods of the microstructures as well as different types of MEMS sensors and their sensing mechanism.
Content Introduction of the properties of Silicon (Si) element, Silicon etching methods, photolithography, thin film deposition, bulk and surface micromachining, microstructure fabrication process and sensing mechanisms.
Topics
Materials
Materials are not specified.
Resources
Course Assessment
Assesment MethodsPercentage (%)Assesment Methods Title
Final Exam50Final Exam
Midterm Exam50Midterm Exam
L+P: Lecture and Practice
PQ: Program Learning Outcomes
LO: Course Learning Outcomes